Surface mountable molded electronic component

Details Surface mountable molded electronic component Surface mountable molded electronic component

1991-09-23

1994-03-15

Picard, Leo P.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

257787, 336 96, 174 35R, 361773, 361816, H01L 2328, H05K 900, H01F 2702

Patent

active

052947491

ABSTRACT:
A surface mountable molded electronic component (100) is made from formed wire having a main portion (202) and end portions (102 and 104) connected to the main portion (202). The electronic component (100) includes a first and second recess areas (108 and 110) in molded section (114) for allowing the end portions (102 and 104) to lie inside and provide for the component (100) to be surfaced mounted onto a printed circuit board.

REFERENCES:
patent: 3660791 (1972-05-01), Davis
patent: 4717901 (1988-01-01), Autenrieth et al.
patent: 4751481 (1991-06-01), Guzik et al.
patent: 4769900 (1988-09-01), Morinaga et al.

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