Surface mountable microwave IC package

Details Surface mountable microwave IC package Surface mountable microwave IC package

1985-04-26

1986-12-02

Gensler, Paul

Wave transmission lines and networks

Coupling networks

With impedance matching

333246, 333260, H01P 500

Patent

active

046268057

ABSTRACT:
A surface mountable microwave IC package uses printed transmission lines on a printed circuit board in lieu of plumbing between milled packages. A backside co-planar waveguide is connected to a topside microstrip line by a through-hole in a carrier substrate. To compensate for inductance added by the hole and transmission line ends, a gap is adjusted to provide compensation capacitance. Hermetic sealing of the package is assured by brazing a lead frame over the through-hole and using a solder sealed lid. The lid provides both a hermetic seal and shielding.

REFERENCES:
patent: 3842360 (1974-10-01), Dickens
patent: 3848198 (1974-11-01), DeBrecht et al.
patent: 4110712 (1978-08-01), Morris
patent: 4543544 (1985-09-01), Ziegner

Affiliated with

Also associated with

Rating

Surface mountable microwave IC package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Surface mountable microwave IC package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Surface mountable microwave IC package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2295370