Surface mountable microwave IC package

Details Surface mountable microwave IC package Surface mountable microwave IC package

1993-01-13

1995-06-13

Gensler, Paul

Wave transmission lines and networks

Coupling networks

With impedance matching

333247, 333246, H01P 500

Patent

active

054246938

ABSTRACT:
A surface mountable microwave IC package with broad bandwidth and low loss has been developed. The impedance mismatch due to the electrical discontinuity of the I/O pads and via holes in the structure is compensated. The compensation structure has two features. In one feature, ground planes are printed on both sides of a dielectric substrate to increase the distributed capacitance between the signal line and the ground, thereby obtaining a matched characteristic impedance. In the second feature, two grounding via holes are used to compensate for the mismatch of the charactersitic impedance due to the feedthrough via-slot connection of the signal line from the back-side to the front-side of the substrate.

REFERENCES:
patent: 3093805 (1963-06-01), Osifchin et al.
patent: 5057798 (1991-10-01), Moye et al.
patent: 5229727 (1993-07-01), Clark et al.
patent: 5294897 (1994-03-01), Notari et al.

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