Surface mountable leaded package

Details Surface mountable leaded package Surface mountable leaded package

1993-07-06

1996-01-30

Paumen, Gary F.

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

Distinct contact secured to panel circuit

H01R 402

Patent

active

054876745

ABSTRACT:
A method and an apparatus provide a surface mountable package (100) with leads (150) having free end portions (355) coplanar in a target plane (370). The method includes forming the leads (150) such that the free end portions (355) angle away from the target plane (370), and biasing the free end portions (355) against a biasing surface (365) integral to the package (100) such that the free end portions (355) are forced toward the target plane (370) and into a coplanar state. The apparatus includes a housing (110), a plurality of leads (150) with free end portions (355) preformed to angle away from the target plane (370) mounted onto the housing (110), and a biasing surface (365), located on the package (100), to bias the free end portions (355) toward the target plane (370).

REFERENCES:
patent: Re29223 (1977-05-01), Pritulsky
patent: 2711523 (1955-06-01), Willis
patent: 4176900 (1979-12-01), Hines et al.
patent: 4536955 (1985-08-01), Gudgeon
patent: 4721472 (1988-01-01), Gentry et al.
patent: 4875863 (1989-10-01), Reed
patent: 5128834 (1992-07-01), Kaschke
patent: 5133670 (1992-07-01), Doi et al.
patent: 5346404 (1994-09-01), Shimada

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