Surface mountable integrated circuit with conductive vias

Details Surface mountable integrated circuit with conductive vias Surface mountable integrated circuit with conductive vias

1995-06-05

1997-03-04

Prenty, Mark V.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

257751, 257773, 257777, H01L 2348

Patent

active

056082649

ABSTRACT:
A surface mountable integrated circuit and a method of manufacture are disclosed. A wafer 110 has a die with an integrated circuit 119 in one surface of the wafer. A via 130 extends to the opposite surface. the via has a sidewall oxide 131 and is filled with a conductive material such as metal or doped polysilicon. The metal may comprise a barrier layer and an adhesion layer. The second end of the via can be fashioned as a prong 233 or a receptacle 430. Dies with vias can be stacked on top of each other or surface mounted to printed circuit boards or other substrate.

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