Surface mountable integrated circuit packages having solder bear

Details Surface mountable integrated circuit packages having solder bear Surface mountable integrated circuit packages having solder bear

1985-10-31

1987-04-28

Pellinen, A. D.

Electricity: electrical systems and devices

Miscellaneous

29840, 174 94R, 339275R, H01R 909

Patent

active

046618872

ABSTRACT:
An integrated circuit package having a plurality of leads capable of holding a quantity of solder paste prior to bonding to a printed circuit board or other substrate. The solder paste bearing structure may be straight or spiral grooves, or even a slot or roughened surface, running down at least the lower length of the leads as long as some mechanism is present which will first hold the solder paste or other electrically conductive binder on the lead and then deliver the binder to the end of the lead to produce an electrical and structural bond in a binder flowing operation. Application of the solder paste to the leads is accomplished by simply dipping the package leads into the paste thereby eliminating the need to make a solder mask for the substrate as well as the task of aligning the mask to the substrate.

REFERENCES:
patent: 1702234 (1929-02-01), Goodridge
patent: 3842190 (1974-10-01), Towell
patent: 4056302 (1977-11-01), Braun et al.
patent: 4274699 (1981-06-01), Keim
patent: 4463407 (1984-07-01), Berger et al.
patent: 4513355 (1985-04-01), Schroeder et al.
J. W. Balde, et al., "Alternatives in VLSI Packaging," VLSI Design Dec., 1983, pp. 23-29.
J. Lyman, "Frame Permits Use of Glass Boards," Electronics, Jun. 28, 1984, pp. 54 and 56.
McAtee, "Dual-In-Line Package, Pyggyback structure", IBM Tech. Disclosure Bulletin, vol. 16, No. 4, p. 1315, Sep. 1973, 174-52 FP.

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