Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent
1994-11-30
1996-03-12
Hille, Rolf
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
257678, 257727, 257726, 257785, 257924, 365229, H01L 2302
Patent
active
054989035
ABSTRACT:
An integrated circuit package of the surface-mountable type within which a battery is mounted is disclosed. Battery leads extend from the side of the package body opposite that which is adjacent the circuit board when mounted, and between which a conventional battery may be placed. Standoffs are located on the package body for supporting the battery above the package body, so that a gap is present therebetween. A housing is attached to the package over the battery, and has standoffs attached to its inner surface so that a gap is also present between the housing and the battery. The gaps may be air gaps or filled with a low thermal conductivity material. The gaps thermally insulate the battery from the package body and housing, so that the circuit may be subjected to solder reflow mounting to a circuit board, while insulating the high temperatures from the battery.
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Dixon D. Craig
Hundt Michael J.
Anderson Rodney M.
Hardy David B.
Hille Rolf
Jorgenson Lisa K.
Robinson Richard K.
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