Surface mountable integrated circuit package with detachable mod

Details Surface mountable integrated circuit package with detachable mod Surface mountable integrated circuit package with detachable mod

1997-10-30

1999-11-30

Arroyo, Teresa M.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Device held in place by clamping

257678, 257684, 257697, 361785, 439 86, 439586, H01L 2334, H01L 2302, H01L 2306, H01L 2348

Patent

active

059947748

ABSTRACT:
A modular integrated circuit package is mounted on a surface of a printed circuit board. The integrated circuit package includes a rigid interposer releasably coupling a component module to a substrate member designed to be affixed to the printed circuit board. The substrate member has a first side with plural first electrical connectors for connection to the circuit board and a second side with second electrical connectors coupled to the first electrical connectors. The interposer includes a plurality of electrical connectors that couple electrical connectors of the component module to the second electrical connectors of the substrate member. The component module also includes plural clip members that engage a lower surface of the interposer to releasably couple the component module to the interposer.

REFERENCES:
patent: 5557504 (1996-09-01), Siegel et al.
patent: 5821691 (1998-10-01), Gerber et al.
patent: 5825630 (1998-10-01), Taylor et al.

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