Surface mountable integrated circuit package with detachable mod

Electricity: electrical systems and devices – Control circuits for electromagnetic devices – For relays or solenoids

Patent

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Details

361772, 361774, 361813, 174250, 257666, 439 59, H01R 900

Patent

active

055575048

ABSTRACT:
A molded integrated circuit package system of the type suitable for surface mounting is disclosed. The system includes a chip package having leads along its sides that are of the surface-mountable type, and having a plurality of connectors at its ends. A module is provided which contains components that are sensitive to solder temperatures or the chemicals used in the soldering process; examples of such components include batteries and quartz crystal resonators. The module has connectors extending therefrom that mate with the connectors on the chip package, such that the module may be removably connected to the chip package after the surface mounting of the chip package to a circuit board. Mechanical connection may be provided by snap members extending from the module which engage surfaces of the chip package when mounted thereto. Lockout tabs are provided on the chip package and the module to prevent improper mounting and electrical connection.

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