Surface mountable integrated circuit package equipped with socke

Details Surface mountable integrated circuit package equipped with socke Surface mountable integrated circuit package equipped with socke

1986-05-27

1988-05-24

Scott, J. R.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

361403, 174 52FP, 439 68, H05K 114, H05K 502

Patent

active

047470178

ABSTRACT:
A surface mount package formed by nesting an encapsulated tape automated bonding integrated circuit module in between two plastic rings snapped together, the inner surface of the outer ring contains recessed sockets for receiving socket pins upstanding on a circuit board.

REFERENCES:
patent: 3345541 (1967-10-01), Cobaugh et al.
patent: 3380016 (1968-04-01), Samson et al.
patent: 3441853 (1969-04-01), Bodine
patent: 3648108 (1972-03-01), Bailey
patent: 3693131 (1972-09-01), Klehm, Jr.
patent: 3735214 (1973-05-01), Renskers et al.
patent: 3757271 (1973-09-01), Judge et al.
patent: 4089575 (1978-05-01), Grabbe
patent: 4155615 (1979-05-01), Zimmerman, Jr. et al.
patent: 4164003 (1979-09-01), Cutchaw
patent: 4330683 (1982-05-01), Parker
patent: 4331831 (1982-05-01), Ingram et al.
patent: 4465898 (1984-09-01), Orcutt et al.

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