Surface-mountable, frequency selective microwave IC package

Details Surface-mountable, frequency selective microwave IC package Surface-mountable, frequency selective microwave IC package

1992-09-11

1995-02-14

Ham, Seungsook

Wave transmission lines and networks

Long line elements and components

Strip type

333204, 333247, H01P 308, H01P 100

Patent

active

053899040

ABSTRACT:
This invention discloses a monolithic microwave integrated circuit (MMIC) package with filtering property. The filtering action is inherent with the structure of the package. This structure overcomes the limitation of traditional packages, which can only transmit the signal without processing the signal. A specially designed surface-mountable structure is used in the input and the output terminals. Any impedance from this special structure can be compensated by the filtering structure in each port. The filtering structure is located between the input (or the output) structure and the die cavity in each port. The package also provides ground connection to the MMIC by means of metal-filled via holes connected to the surface mounting side.

REFERENCES:
patent: 3483308 (1969-12-01), Wakely
patent: 4353047 (1982-10-01), Noguchi et al.
patent: 4626805 (1986-12-01), Jones
patent: 4713634 (1987-12-01), Yamamura
patent: 4768004 (1988-08-01), Wilson
patent: 4899118 (1990-02-01), Polinski, Sr.
patent: 4901041 (1990-02-01), Pengelly
patent: 4951014 (1990-08-01), Wohlert et al.
patent: 5014115 (1991-05-01), Moser
patent: 5065123 (1991-11-01), Heckaman et al.

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