Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1997-09-08
1999-07-27
Bradley, Paula
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439496, H01R 909
Patent
active
059280018
ABSTRACT:
A surface mountable flexible interconnect (100) for connecting two electronic subassemblies is constructed from a flexible film substrate (110). Conductive metal runners (120) run along the bottom surface (114) of the substrate and connect an array of solder pads (122), each having an attached solder bump (123), to a second terminal portion (124) located at the second end of the substrate. A rigid sheet of printed circuit board material (130), attached to the top surface of the substrate using a strong adhesive (142), lies directly above the array of solder pads and acts as stress relief mechanism. A slightly tacky temporary adhesive (140) is used to attach the second end of the substrate to the topside (132) of the rigid sheet.
REFERENCES:
patent: 4367006 (1983-01-01), Rehbogen, Jr. et al.
patent: 5097101 (1992-03-01), Trobough
patent: 5430614 (1995-07-01), Difrancesco
patent: 5433632 (1995-07-01), Cherney et al.
patent: 5742484 (1998-04-01), Gillette et al.
Gillette Joseph G.
Lall Pradeep
Potter Scott
Bradley Paula
Davis Katrina
Dorinski Dale W.
Motorola Inc.
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