Surface mountable device

Details Surface mountable device Surface mountable device

2004-07-16

2011-11-15

Chervinsky, Boris (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S767000, C361S768000, C361S772000, C361S773000, C361S774000, C174S260000, C174S261000, C174S262000, C174S263000

Reexamination Certificate

active

08059420

ABSTRACT:
A surface mountable device includes a ceramic substrate including a first principal surface, a second principal surface, and a side surface connecting the first principal surface to the second principal surface, a terminal electrode disposed on the first principal surface, and a first conductor for appearance inspection extending continuously from the terminal electrode to the side surface and having a width smaller than the width of the terminal electrode.

REFERENCES:
patent: 4578736 (1986-03-01), Brown
patent: 5388029 (1995-02-01), Moriyama
patent: 5600101 (1997-02-01), Sakai
patent: 5625935 (1997-05-01), Kubota et al.
patent: 5805423 (1998-09-01), Wever et al.
patent: 6011693 (2000-01-01), Gore
patent: 6140891 (2000-10-01), Nakakubo et al.
patent: 6459048 (2002-10-01), Sakai et al.
patent: 6920037 (2005-07-01), Sano et al.
patent: 7193862 (2007-03-01), Maekawa et al.
patent: 2-305492 (1990-12-01), None
patent: 06-053002 (1994-02-01), None
patent: 08-250620 (1996-09-01), None
patent: 10-170455 (1998-06-01), None
patent: 11-186092 (1999-07-01), None
patent: 2000-068148 (2000-03-01), None
patent: 2001-85825 (2001-03-01), None
patent: 2002-311486 (2002-10-01), None
patent: 2002-359320 (2002-12-01), None
Official communication issued in counterpart Chinese Application No. 2004800010629, mailed on Jun. 27, 2008.
International Search Report for PCT Application No. PCT/JP2004/010188, mailed Nov. 9, 2004.
Official communication issued in counterpart Chinese Application No. 2004800010629, issued on Dec. 28, 2007.
Official communication issued in counterpart Chinese Application No. 200480001062.9, mailed on Mar. 6, 2009.
Official communication issued in counterpart Japanese Application No. 2005-511853, mailed on Dec. 18, 2007.

Affiliated with

Also associated with

Rating

Surface mountable device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Surface mountable device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Surface mountable device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4295206