Surface mountable chip

Details Surface mountable chip Surface mountable chip

2011-01-04

2011-01-04

Huynh, Andy (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Incoherent light emitter structure

In combination with or also constituting light responsive...

C257S079000, C257S084000, C257S088000, C257S099000, C257S100000, C257SE33044, C257SE33057

Reexamination Certificate

active

07863626

ABSTRACT:
A surface mountable device having a circuit device and a base section. The circuit device includes top and bottom layers having a top contact and a bottom contact, respectively. The base section includes a substrate having a top base surface and a bottom base surface. The top base surface includes a top electrode bonded to the bottom contact, and the bottom base surface includes first and second bottom electrodes that are electrically isolated from one another. The top electrode is connected to the first bottom electrode, and the second bottom electrode is connected to the top contact by a vertical conductor. An insulating layer is bonded to a surface of the circuit device and covers a portion of a vertical surface of the bottom layer. The vertical conductor includes a layer of metal bonded to the insulating layer.

REFERENCES:
patent: 5696389 (1997-12-01), Ishikawa et al.
patent: 6599768 (2003-07-01), Chen
patent: 2004/0120155 (2004-06-01), Suenaga
patent: 2005/0211997 (2005-09-01), Suehiro et al.
patent: 2006/0043402 (2006-03-01), Suehiro et al.
patent: 2006/0261364 (2006-11-01), Suehiro et al.

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