Surface mount type unit and transducer assembly using same

Details Surface mount type unit and transducer assembly using same Surface mount type unit and transducer assembly using same

1997-02-21

2000-05-09

Chaudhuri, Olik

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With housing mount

257733, 361760, H01L 2312

Patent

active

060607807

ABSTRACT:
A surface mount type semiconductor package is mounted on a printed board by bonding, by means of solder bumps signal electrodes, electrically connected to respective terminals of a semiconductor chip incorporated in the package, with lands provided on the printed board. On a mount surface of the package, there are provided auxiliary electrodes formed as electrodes which are not electrically connected to the respective terminals of the semiconductor chip and have a thickness greater than that of the signal electrodes. As a result, solder thickness is secured for the solder bumps between each signal electrode and corresponding land by the difference in thickness between the auxiliary electrode and the signal electrode.

REFERENCES:
patent: 5388459 (1995-02-01), Inoue et al.
patent: 5503016 (1996-04-01), Koen
patent: 5514899 (1996-05-01), Lau et al.
patent: 5554806 (1996-09-01), Mizuno et al.
patent: 5639696 (1997-06-01), Liang et al.
patent: 5724728 (1998-03-01), Bond et al.
The Engineering Society for Advancing Mobility Land Sea Air and Space International, At International Congress and Expositio-Detroit, Michigan, Feb. 27 -Mar. 2, 1995 "New Accelerometer Based on Innovative Packaging and Circuit Design" D.W. de Bruin et al.
Electronics Mounting Technology (vol. 10 No. 8, 1994, 8) "Bump Mounting Technology for Passive Chip".
Journal of Metallurgical Society of Japan vol. 23, No. 12, 1984 "Microsolder Bonding Technology for IC,LSI".

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