Surface mount type package unit and method for manufacturing the

Details Surface mount type package unit and method for manufacturing the Surface mount type package unit and method for manufacturing the

1997-12-10

1999-05-04

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361748, 361763, 361767, 361764, 361783, 7351435, 7351401, 174260, 174250, 174255, 174 525, 257723, 257724, 438 53, H05K 702

Patent

active

059010460

ABSTRACT:
A package body holding an acceleration sensor circuit therein has signal electrodes and four dummy electrodes insulated from the signal electrode on a mounted surface thereof. The signal electrodes are electrically connected to the sensor circuit element. The mounted surface of the package body has chamfered portions on verge portions thereof, and auxiliary electrodes are formed on the chamfered portions to be integrally connected to the signal electrodes. The thus constructed package body is mounted on a circuit board by a reflow method using a solder paste so that the signal, dummy, and auxiliary electrodes are connected to a wiring pattern on the circuit board through solder portions. In this process, the solder paste on the dummy electrodes in a fused state generate an internal pressure to retain a clearance between the package body and the circuit board. As a result, the thickness of the solder portions between the package body and the circuit board can be secured, and reliability at a mounted state is improved.

REFERENCES:
patent: 5212345 (1993-05-01), Gutierrez
patent: 5343748 (1994-09-01), Mozgowiec et al.
patent: 5345823 (1994-09-01), Reidemeister et al.
patent: 5471089 (1995-11-01), Nagatomo et al.
patent: 5554806 (1996-09-01), Mizuno et al.
patent: 5693883 (1997-12-01), Giroud et al.
patent: 5734106 (1998-03-01), Caillat

Affiliated with

Also associated with

Rating

Surface mount type package unit and method for manufacturing the does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Surface mount type package unit and method for manufacturing the, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Surface mount type package unit and method for manufacturing the will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1874360