Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2011-01-11
2011-01-11
Blum, David S (Department: 2813)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Packaging or treatment of packaged semiconductor
C438S065000, C438S125000, C362S555000, C257SE23129, C257SE31127, C257SE33056
Reexamination Certificate
active
07867794
ABSTRACT:
A small and thin surface-mount type optical semiconductor device having high air tightness, which can be manufactured at a reduced cost includes: a base2formed of a glass substrate; a recess5formed on a first main surface3of the base; a through hole7extending from a bottom portion4of the recess to a second main surface6of the base; an inner wall conductive film formed on an inner wall surface of the through hole; a wiring pattern9made of a conductive film formed around an opening of the through hole on the bottom portion of the recess so as to be connected electrically to the inner wall conductive film; an optical semiconductor element8bonded to the wiring pattern via a conductive bonding material14; a terminal portion10made of a conductive film formed around an opening of the through hole on the second main surface such that it is connected electrically to the inner wall conductive film; and a metal portion13bonded to the inner wall conductive film to clog the through hole.
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Futakawa Tomoyuki
Kimura Mitsuyuki
Yamashita Hiroto
Yamashita Kaoru
Blum David S
Hamre Schumann Mueller & Larson P.C.
Panasonic Corporation
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