Surface mount testing system

Details Surface mount testing system Surface mount testing system

2007-01-18

2010-11-23

Hoang, Tu B (Department: 3742)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S073100, C219S482000

Reexamination Certificate

active

07839157

ABSTRACT:
Embodiments may include a method and an apparatus for inducing degradation through temperature cycling of a solder joint or a component on a surface mount printed wiring board (SMPWB) coupon. The coupon may include alternating layers of dielectric material and conductive material stacked one upon another and a heating trace mounted on a surface of the SMPWB or between layers of dielectric material. A first value indicative of a temperature of the heating trace may be determined based on a measured electrical resistance of the heating trace. A difference between the first value and a second value indicative of a desired temperature of the heating trace may be determined. A particular current and a particular voltage may be applied to the heating trace based on the determined difference between the first value and the second value.

REFERENCES:
patent: 5451885 (1995-09-01), Birch et al.
patent: 5701667 (1997-12-01), Birch et al.
patent: 5718628 (1998-02-01), Nakazato et al.
patent: 6181556 (2001-01-01), Allman
patent: 6262392 (2001-07-01), Morton et al.
patent: 6970355 (2005-11-01), Ellsworth, Jr. et al.

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