Surface mount technology to via-in-pad interconnections

Details Surface mount technology to via-in-pad interconnections Surface mount technology to via-in-pad interconnections

2005-08-09

2005-08-09

Cuneo, Kamand (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S262000, C029S840000, C029S843000, C228S180100, C228S180210

Reexamination Certificate

active

06927346

ABSTRACT:
Apparatus and methods for interconnecting a SMT component interconnect to a via-in-pad (VIP) interconnect. A first reflowable material is deposited on the VIP bond pad. A sphere having a higher melt temperature than the reflow temperature of the first interconnect material is deposited on the first interconnect material. A first reflow process is performed to interconnect the sphere and the VIP bond pad while the sphere remains solid, and the first reflowable material preventing the first interconnect material from migrating into the via-in-pad.

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