Surface mount stress relief interface system and method

Details Surface mount stress relief interface system and method Surface mount stress relief interface system and method

1993-11-08

1994-11-29

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361760, 361768, 361 86, 174 35R, 174261, 439 91, 439 65, 439 88, H05K 100

Patent

active

053695518

ABSTRACT:
An interface printed circuit board is configured to be placed between a leadless component such as a surface mount package used to house a SAW device and a standard printed circuit board configured for solder joints in a leadless contact with the printed circuit board. The interface device is made using materials having similar characteristic thermal expansion properties as that of the printed circuit to with it is affixed. Solder pads are placed in offset pairs and interface board material is removed such that the combination causes the interface board to flex from the forces caused by the differing expansion coefficients of the solder, the package and the printed circuit boards. The configuration causes the relative movement between the leadless carrier and the printed circuit board to occur along a length of epoxy and glass board material by bending the epoxy and glass as opposed to applying tensional or compressive forces to the solder joints. Such an approach relieves the stress and resulting creep seen at solder joints in the typical solder joint or column. In addition, by segregating the input and output pads and placing a metal shield between them, crosstalk rejection of the components is improved.

REFERENCES:
patent: 3588616 (1971-06-01), Palazzini
patent: 4357647 (1992-11-01), Hadersbeck
patent: 4895524 (1990-01-01), Thepault
patent: 5155905 (1992-11-01), Miller, Jr.

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