Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1998-07-23
2000-01-18
Nguyen, Khiem
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439331, H01R 909
Patent
active
060153016
ABSTRACT:
A surface mount socket having a capability to permit replacing a surface mount component. The component is biased with a spring toward an area array site on a substrate. The component and spring are positioned within a base adjacent the area array site and mechanically held down with a coupler. An interconnect structure for use therewith is provided.
REFERENCES:
patent: 5334029 (1994-08-01), Akkapeddi et al.
patent: 5362243 (1994-11-01), Huss et al.
patent: 5485351 (1996-01-01), Hopfer et al.
patent: 5602719 (1997-02-01), Kinion
patent: 5651688 (1997-07-01), Lin
patent: 5785535 (1998-07-01), Brodsky et al.
Brodsky William Louis
Chan Benson
Myrto Glenn Edward
Sherman John Henry
Fraley Lawrence R.
International Business Machines - Corporation
Nguyen Khiem
Pivnichny John R.
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