Surface-mount saw device

Electrical generator or motor structure – Non-dynamoelectric – Piezoelectric elements and devices

Reexamination Certificate

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Details

C310S340000, C310S348000

Reexamination Certificate

active

07608977

ABSTRACT:
A surface-mount SAW device configured to prevent sealing resin layer coated all over the top surface of a piezoelectric substrate from becoming charged even if the piezoelectric substrate forming the SAW device is made of a pyroelectric material. The SAW device is composed of a mounting substrate; a SAW chip provided with a piezoelectric substrate, an IDT electrode formed on one surface of said piezoelectric substrate, and connection pads connected via conductor bumps to conductor traces; a flip chip mounted to the mounting substrate; and a sealing resin layer coated all over the outer surface of the SAW chip flip-chip mounted on the mounting substrate and extended down to the top surface of the mounting substrate to define an airtight space between the IDT electrode and the mounting substrate; and wherein the electrical conductivity of the piezoelectric substrate is increased to suppress charging of the sealing resin layer.

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patent: 6969945 (2005-11-01), Namba et al.
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Table 7.9 on p. 458 of a book titledApplied Physics Handbook2ndEd. written by Japan Society of Applied Physics and published in Japan on Apr. 25, 2002 by Maruzen Co., Ltd.

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