Surface mount power supply package and method of manufacture the

Details Surface mount power supply package and method of manufacture the Surface mount power supply package and method of manufacture the

1998-05-14

1999-09-28

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361736, 361747, 361757, 361767, 361771, 361813, 174 522, 26427211, H05K 714, H05K 712

Patent

active

059598425

ABSTRACT:
A surface mount package for containing a board-mounted power supply, a method of manufacturing the same and a board-mounted power supply employing the package. In one embodiment, the package includes: (1) a plurality of leads having first ends and second, surface mount ends, (2) a dielectric lead frame that retains the plurality of leads in predetermined positions relative to one another such that at least some of the second, surface mount ends are co-planar, the first ends couplable to the board-mounted power supply, (3) a shell, coupled to the lead frame, that forms a portion of a periphery of the surface mount package and (4) potting material located between the lead frame and the shell.

REFERENCES:
patent: D357901 (1995-05-01), Horman
patent: 4645943 (1987-02-01), Smith, Jr. et al.
patent: 4899256 (1990-02-01), Sway-Tin
patent: 5526234 (1996-06-01), Vinciarelli et al.
patent: 5703754 (1997-12-01), Hinze
patent: 5757251 (1998-05-01), Hashinaga et al.
patent: 5835350 (1998-11-01), Stevens

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