Surface mount plastic package semiconductor integrated circuit,

Details Surface mount plastic package semiconductor integrated circuit, Surface mount plastic package semiconductor integrated circuit,

1988-02-25

1990-04-24

James, Andrew J.

Fishing, trapping, and vermin destroying

437220, 437217, 437219, 29856, 361421, 357 70, 357 72, 357 74, H01L 2978

Patent

active

049200747

ABSTRACT:
The present invention provides a surface mount Gull-Wing type resin-encapsulating package for encapsulating a semiconductor chip, wherein the cut face (outer tip end) of each outer lead is formed to have a smaller cross-sectional area than that of each outer lead, for improving the extension of solder to the cut face of that lead. Such relatively smaller cross-sectional area of the outer tip end of each outer lead reduces the exposed area of the lead material when disconnecting the leads from the frame in separating the device from the frame.

REFERENCES:
"Micro Devices No. 2" Nikkei McGraw-Hill, 6/11/84, pp. 148-154.

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