Surface-mount packaging for chip

Details Surface-mount packaging for chip Surface-mount packaging for chip

2008-04-29

2008-04-29

Clark, S. V. (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S797000

Reexamination Certificate

active

07365419

ABSTRACT:
A chip includes a plurality of pins; and a plurality of symbols defined on a surface of the chip, wherein the symbols are arranged as a graduated scale corresponding with the pins. It becomes very easy to find a initial pin from among the plurality of pins of the chip.

REFERENCES:
patent: 5909122 (1999-06-01), Chung et al.
patent: 6281695 (2001-08-01), Chung et al.

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