Surface mount package for R.F. devices

Details Surface mount package for R.F. devices Surface mount package for R.F. devices

1990-08-17

1992-05-26

Picard, Leo P.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

357 74, 361392, H01L 2302

Patent

active

051170680

ABSTRACT:
A TO-8 surface-mount package assembly for R.F. and microwave devices is disclosed. The assembly includes a lead-frame positioned beneath an alumina base. The alumina base supports a number of solid metal vias. The vias electrically connect the lead-frame to an R.F. or microwave device which is attached to the vias. The assembly also includes a gold plated Kovar seal-ring positioned over the base. The seal-ring and base are brazed together. A cover is then positioned over the seal-ring and welded to the seal-ring.

REFERENCES:
patent: 4287772 (1981-09-01), Mounteer et al.
patent: 4644096 (1987-02-01), Gutierrez et al.
patent: 4649229 (1987-03-01), Scherer et al.
patent: 4990720 (1991-02-01), Kaufman

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