Surface mount package for encapsulated tape automated bonding in

Details Surface mount package for encapsulated tape automated bonding in Surface mount package for encapsulated tape automated bonding in

1986-03-03

1987-11-17

Moy, Joseph Man-Fu

Special receptacle or package

For a vehicle

174 57FP, B65D 7302

Patent

active

047068116

ABSTRACT:
A surface mount package formed by nesting an encapsulated tape automated bonding integrated circuit module in between two plastic rings snapped together.

REFERENCES:
patent: 3746157 (1973-07-01), I'Anson
patent: 3823350 (1974-07-01), Stoner
patent: 3950603 (1976-11-01), Brefka
patent: 4195193 (1980-03-01), Grabbe et al.
patent: 4209798 (1980-06-01), Beretta
patent: 4330683 (1982-05-01), Parker
patent: 4585121 (1986-04-01), Capelle, Jr.
patent: 4615441 (1986-10-01), Nakamura

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