Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2007-01-02
2007-01-02
Owens, Douglas W. (Department: 2818)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
C257S666000, C257S670000, C257SE23045, C438S110000, C438S112000
Reexamination Certificate
active
11052290
ABSTRACT:
A surface mount package for a multi-chip device has a leadframe formed with first and second die pads and readouts from the respective die pads. An environmentally responsive sensor chip is secured to the first die pad and an environmentally isolated chip is secured to the second die pad. The chips are electrically coupled through the lead frame. A body formed with an over molded portion encases the isolated chip and an open molded portion formed with a recess receives the environmentally sensitive chip. An apertured cover is secured in the recess to form a protective covering over the sensor chip and for allowing communication of the sensor chip externally of the package.
REFERENCES:
patent: 4838089 (1989-06-01), Okada et al.
patent: 5491360 (1996-02-01), Lin
patent: 5901046 (1999-05-01), Ohta et al.
patent: 5912556 (1999-06-01), Frazee et al.
patent: 6414388 (2002-07-01), Moriyama
Bryzek Aniela
Dancaster John
Kim Woo-jin
Logan John
Conklin, Esq. Mark
General Electric Company
Nguyen Dao H.
Owens Douglas W.
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