Equipment for production – distribution – or transformation of ene – Distribution – modification or control – Semiconductor – transistor or integrated circuit
Design Patent
2001-05-18
2002-08-27
Gandy, James (Department: 2912)
Equipment for production, distribution, or transformation of ene
Distribution, modification or control
Semiconductor, transistor or integrated circuit
Design Patent
active
D0462062
CLAIM:
The ornamental design for a surface mount package, as shown and described.
REFERENCES:
patent: 5224021 (1993-06-01), Takada et al.
patent: 5446623 (1995-08-01), Kanetake
patent: 5521429 (1996-05-01), Aono et al.
patent: 5689135 (1997-11-01), Ball
JEDEC Solid State Product Outlines, “Small Outline J-Lead” (SOJ) .300 Body Family (MS-013 Body), Issue A, Jun., 1988, MO-088, AA-AF.
JEDEC Solid State Product Outline, Low Profile Small Outline J-Lead Package (LSOJ), PRSO-J/LSOJ, Issue B, Jun., 1999, MO-199, pp. 1-5.
JEDEC Solid State Product Outlines, “Plastic Small Outline (SOJ) Package Family with .330 Inch Body Width”, Issue B, May, 1992, MO-121, pp. 1-2.
Chia Anthony
Harnden James
Weibing Chu
Williams Richard K.
Gandy James
GEM Services, Inc.
Sikder Selina
Townsend & Townsend & Crew LLP
LandOfFree
Surface mount package does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Surface mount package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Surface mount package will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2909846