Surface mount multichip devices

Details Surface mount multichip devices Surface mount multichip devices

2007-07-10

2007-07-10

Williams, Alexander Oscar (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257SE23034, C257SE23052, C257S677000, C257S685000, C257S723000, C257S686000, C257S777000, C257S698000, C257S696000, C257S724000, C257S725000, C257S690000, C257S691000

Reexamination Certificate

active

11183504

ABSTRACT:
A surface mountable multi-chip device is provided which includes first and second lead frames portions and at least two chips. The lead frame portions each include a header region and a lead region. Beneficially, the header regions of the first and second lead frame portions lie in a common plane, with at least one semiconductor chip being placed on each of the header regions. A conductive member link is placed on top of the two chips to electrically and mechanically interconnect the chips.

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