Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2005-07-19
2005-07-19
Williams, Alexander Oscar (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257S723000, C257S532000, C257S666000, C257S916000, C257S676000, C257S660000, C257S497000, C257S712000, C257S713000, C257S706000, C257S694000, C257S675000, C257S696000, C257S690000, C257S725000, C257S724000, C257S728000, C257S776000, C361S119000, C361S091200, C361S056000, C361S704000, C361S820000, C174S050510
Reexamination Certificate
active
06919625
ABSTRACT:
A surface mountable multi-chip device is provided which includes first and second lead frames portions and at least two chips. The lead frame portions each include a header region and a lead region. Beneficially, the header regions of the first and second lead frame portions lie in a common plane, with at least one semiconductor chip being placed on each of the header regions. A conductive member link is placed on top of the two chips to electrically and mechanically interconnect the chips.
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Horsman Gary
Medley Eamonn
O'Donoghue Finbarr
O'Shea Paddy
General Semiconductor Inc.
Mayer Fortkort & Williams PC
Mayer, Esq. Stuart H.
Williams Alexander Oscar
Williams Esq. Karin L.
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