Surface mount multichip devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Reexamination Certificate

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Details

C257S723000, C257S532000, C257S666000, C257S916000, C257S676000, C257S660000, C257S497000, C257S712000, C257S713000, C257S706000, C257S694000, C257S675000, C257S696000, C257S690000, C257S725000, C257S724000, C257S728000, C257S776000, C361S119000, C361S091200, C361S056000, C361S704000, C361S820000, C174S050510

Reexamination Certificate

active

06919625

ABSTRACT:
A surface mountable multi-chip device is provided which includes first and second lead frames portions and at least two chips. The lead frame portions each include a header region and a lead region. Beneficially, the header regions of the first and second lead frame portions lie in a common plane, with at least one semiconductor chip being placed on each of the header regions. A conductive member link is placed on top of the two chips to electrically and mechanically interconnect the chips.

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