Surface mount microcircuit hybrid

Details Surface mount microcircuit hybrid Surface mount microcircuit hybrid

1992-07-24

1993-12-14

Gensler, Paul

Wave transmission lines and networks

Long line elements and components

Strip type

333247, 29846, H01P 500

Patent

active

052706737

ABSTRACT:
A surface-mountable packageless hybrid comprising a ceramic substrate with circuit elements attached to a top surface of the substrate is soldered to a ground pad on a printed circuit board. A high performance transition for microwave frequency signals between the circuit board and the substrate is provided by RF connections comprising three gull wing shaped leads connecting three solder pads on the printed circuit board to three solder pads on the substrate, the solder pads having capacitive matching sections to compensate for lead inductance. The center lead conducts the microwave frequency signal while the outer leads are grounded.

REFERENCES:
patent: 3351816 (1967-11-01), Sear et al.
patent: 3398232 (1968-08-01), Hoffman
patent: 3460069 (1968-08-01), Uberbacher et al.
patent: 3568098 (1971-03-01), Gerst
patent: 3780431 (1973-12-01), Feeney
patent: 3876822 (1975-04-01), Davy et al.
patent: 4127832 (1978-11-01), Riblet
patent: 4150345 (1979-04-01), Goldman et al.
patent: 4366198 (1982-12-01), Ramspacher, Jr.
patent: 4372046 (1983-02-01), Suzuki
patent: 4375053 (1983-02-01), Viola et al.
patent: 4375054 (1983-02-01), Pavio
patent: 4538346 (1985-09-01), Street
patent: 4600907 (1986-07-01), Grellman et al.
patent: 4609892 (1986-09-01), Higgins, Jr.
patent: 4626805 (1986-12-01), Jones
patent: 4647878 (1987-03-01), Landis et al.
patent: 4673904 (1987-06-01), Landis
patent: 4681656 (1987-07-01), Byrum
patent: 4758927 (1988-07-01), Berg
patent: 4806892 (1989-02-01), Thorpe et al.
patent: 4821007 (1989-04-01), Fields et al.
patent: 4891686 (1990-01-01), Krausse, III
patent: 5023624 (1991-06-01), Heckaman et al.
Ellenberger, "Packaging Faster Silicon Circuits," High Speed Outlook, pp. 121-124, Aug., 1988.
ASPE RF Surface Mount Advance, Total Glass-Filled Cavities Maintain 50 Ohm Lines Integrity, Brochure by ASPE, Inc, Towaco, N.J., one page, not dated.
MA4GM201 Series GaAs MMIC DC-2 GHz SPST Switch, Brochure by M/A-COM Advanced Semiconductor Operations, Lowell, Mass., 3 pages, not dated.
Ishitsuka et al., "Low Cost, High Performance Package For A Multi-Chip MMIC Module," NTT Applied Electronics Laboratories, 1988 IEEE, pp. 221-224.
Pengelly et al., "High Performance 20-GHz Package for GaAs MMICs," MSN & Communications Technology, 1988, 5 pages.
Brochure describing Tektronix TEKPAK, undated, 2 pages.

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