Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With housing or contact structure
Reexamination Certificate
2000-10-03
2003-03-18
Tran, Minh Loan (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Incoherent light emitter structure
With housing or contact structure
C257S100000
Reexamination Certificate
active
06534799
ABSTRACT:
BACKGROUND OF THE INVENTION
(1) Field of the Invention
This invention relates to semiconductor device package, particularly to surface mount light emitting diode (LED) package.
(2) Brief Description of the Related Art
In semiconductor technology, surface mount packages are sometimes used to hold one semiconductor chip on front side of a substrate and contact to a mother board is made on backside of the substrate.
FIG. 1
shows a prior art package for mounting a LED chip on one side of a substrate
13
. The package has two metal terminals
11
and
12
for external connection. The metal terminal
11
is an extension of a landing on which a semiconductor chip
10
is mounted. In the backside of the substrate, there are corresponding metal terminals. The terminals
11
,
12
are connected to a corresponding terminals in the back through a semicircular plated through conduit
151
and
152
.
The chip
10
has two electrodes
101
and
102
connected by wires
103
and
104
respectively to the terminals
11
and
12
. The wires
103
,
104
are compressed on the terminals
11
and
12
respectively for bonding. The compression creates an expanded compressed area
16
. This compressed area occupies a width d
1
. The semicircular conduit occupies a width d
2
. The chip requires a width d
3
for mounting. Thus the total width W
1
is equal the total of d
1
, d
2
and d
3
, i.e. W
1
=2d
1
+2d
2
+d
3
.
For low cost production, it is important to reduce the size of the package. For a display panel composed of a large number of the LEDs, a closer packaging can increase the light intensity and higher resolution. Therefore, a smaller LED package is what the industry is striving for.
SUMMARY OF THE INVENTION
An object of this invention is to reduce the package of a surface mount semiconductor package. Another object of this invention is to reduce the dimension of LED package. Still another object of this invention is to increase the light intensity and resolution of an LED display panel.
These objects are achievement by placing the plated-through conduits at the corners of the package, so that the expanded compressed area is offset from and lined up vertically with the conduit, thus reducing the total horizontal width of the package.
REFERENCES:
patent: RE36614 (2000-03-01), Lumbard et al.
patent: 6383835 (2002-05-01), Hata et al.
Chang Bill
Wang Bily
H. C. Lin Patent Agent
Harvatek Corp.
Tran Minh Loan
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