Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1991-03-01
1991-12-17
Bradley, Paula A.
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439331, H01R 909, H01R 1362
Patent
active
050731165
ABSTRACT:
A socket (10) for use with leadless chip carriers has been disclosed. The socket (10) includes contact elements (16) positioned in cavities (34) in a housing (12) and having a first spring arm (100) extending into a central opening (30) for engaging pads on the chip carrier and a second spring arm (102) extending outwardly of the housing (12) for electrical engagement with circuits on a substrate on which the socket (10) is mounted.
REFERENCES:
patent: 4220383 (1980-09-01), Scheingold et al.
patent: 4502747 (1985-03-01), Bright et al.
AMP Incorporated
Bradley Paula A.
Osborne Allan B.
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