Surface mount interposer

Details Surface mount interposer Surface mount interposer

1994-03-21

1996-02-13

Thomas, Laura

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174261, 439 65, 439 74, 439 83, 361790, H05K 114

Patent

active

054913039

ABSTRACT:
An interposer (100) for connecting two or more printed circuit boards (302, 304) is a circuit-carrying substrate (102) with two or more solder pads (104, 109)on each of two sides (105, 107). Each of the solder pads are connected to an electrically conductive via (106) in the substrate, providing electrical interconnection from one side to the other side. Each solder pad has a solder bump (108) on it. A circuit assembly is made by soldering the solder bumps on one side of the interposer to corresponding solder pads on a printed circuit board (302). The solder bumps on the other side of the interposer are likewise soldered to the corresponding solder pads of a second printed circuit board (304).

REFERENCES:
patent: 4642889 (1987-02-01), Grabbe
patent: 5218761 (1993-06-01), Maniwa et al.
patent: 5258648 (1993-02-01), Lin

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