Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-06-19
2007-06-19
Chervinsky, Boris (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S704000, C361S707000, C361S719000, C257S706000, C257S712000, C165S080300
Reexamination Certificate
active
10960160
ABSTRACT:
A heat sink surface mounts to a printed circuit board in direct separation, thermal and physical, from components on the board. The heat sink cools the components by conducting heat from the components through the printed circuit board to the heat sink.
REFERENCES:
patent: 5050038 (1991-09-01), Malaurie et al.
patent: D339110 (1993-09-01), Steen, Jr. et al.
patent: 5258887 (1993-11-01), Fortune
patent: 5311395 (1994-05-01), McGaha et al.
patent: 5390078 (1995-02-01), Taylor
patent: 5615087 (1997-03-01), Wieloch
patent: 5930114 (1999-07-01), Kuzmin et al.
patent: 5933324 (1999-08-01), Barrett
patent: 6097603 (2000-08-01), Edwards et al.
patent: 6178628 (2001-01-01), Clemens et al.
patent: 6195256 (2001-02-01), Tiziani et al.
patent: 6212076 (2001-04-01), MacQuarrie et al.
patent: 6219238 (2001-04-01), Andros et al.
patent: 6249434 (2001-06-01), Scafidi
patent: 6294742 (2001-09-01), Ziemkowski
patent: 6301114 (2001-10-01), Ootani
patent: 6335862 (2002-01-01), Koya
patent: 6356447 (2002-03-01), Scafidi
patent: 6400573 (2002-06-01), Mowatt et al.
patent: 6466454 (2002-10-01), Jitaru
patent: 6477054 (2002-11-01), Hagerup
patent: 6519156 (2003-02-01), Scafidi
patent: 6759278 (2004-07-01), Ashdown
patent: 6833993 (2004-12-01), Wang
patent: 6930885 (2005-08-01), Barcley
patent: 7050304 (2006-05-01), Hsu et al.
patent: 7054159 (2006-05-01), Nakamura
patent: 2001/0016981 (2001-08-01), Ziemkowski
patent: 2001/0050429 (2001-12-01), Ashdown
patent: 2003/0227751 (2003-12-01), Wang
patent: 2004/0037044 (2004-02-01), Cook et al.
patent: 2006/0002092 (2006-01-01), Stevens
Rubenstein Brandon A.
Schumacher Derek S.
Simon Glenn C.
Chervinsky Boris
Hewlett--Packard Development Company, L.P.
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