Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1992-10-29
1994-05-10
Thompson, Gregory D.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
165 803, 165185, 174 163, 257707, 257722, 361702, 361709, H05K 720
Patent
active
053113950
ABSTRACT:
A heat sink for electronic devices which are surface mounted on a printed circuit board includes two side members, a connecting bridge, a foot on each side member which is soldered to a mounting pad on the printed circuit board, a locating element on each side member which engages an aperture in the printed circuit board during assembly, and a group of heat dissipating fingers on each side member. The heat sink can be placed over an electronic device which is surface mounted to the mounting pad on the printed circuit board and the feet of the heat sink can be soldered to the mounting pad simultaneously with the soldering of the electronic device to the mounting pad on the printed circuit board.
REFERENCES:
patent: 3213324 (1965-10-01), McAdam
patent: 3548927 (1970-12-01), Spurling
patent: 3670215 (1972-06-01), Wilkens et al.
patent: 4054901 (1977-10-01), Edwards et al.
patent: 4203488 (1980-05-01), Johnson et al.
patent: 4609040 (1986-09-01), Moore
patent: 4710852 (1987-12-01), Keen
patent: 4729426 (1988-03-01), Hinshaw
patent: 4748538 (1988-05-01), Tsuji
patent: 4849856 (1989-07-01), Funari et al.
patent: 4890196 (1989-12-01), Hinshaw
patent: 4965651 (1990-07-01), Gohl et al.
patent: 5019942 (1991-05-01), Clemens
patent: 5022462 (1991-06-01), Flint et al.
patent: 5065279 (1991-11-01), Lazenby et al.
patent: 5130888 (1992-07-01), Moore
"Heat Sink Assembly For TAB-Mounted Devices" IBM Tech. Dis. Bulletin, vol. 31, No. 6, Nov. 1988 pp. 372-373.
"Surface-Mounted Heat Sink Attach For TAB", IBM Tech. Dis. Bulletin, vol. 31, No. 3B, Aug. 1990, pp. 101-103.
Almquist et al., "Spring-Clip Mounted Extruded Aluminum Heat Sink", May 1981, IBM Technical Disclosure Bulletin, vol. 23, No. 12.
McGaha Jerry A.
Zeik Andrew C.
NCR Corporation
Sessler Jr. Albert L.
Thompson Gregory D.
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