Surface mount flipchip capacitor

Details Surface mount flipchip capacitor Surface mount flipchip capacitor

2005-07-05

2005-07-05

Thomas, Eric W. (Department: 2831)

Electricity: electrical systems and devices

Electrolytic systems or devices

Solid electrolytic capacitor

C361S524000, C361S532000

Reexamination Certificate

active

06914770

ABSTRACT:
The surface mount flipchip capacitor of the present invention includes a wire and a conductive powder element electrically connected to the wire. The surface mount flipchip capacitor has insulative material surrounding at least a portion of the conductive powder element and the wire extending below the conductive powder element. A first terminal is formed on the surface mount flipchip capacitor at the first end surface of the wire and a second terminal is formed by being electrically connected to the conductive powder element. The surface mount flipchip capacitor of the present invention is created by methods which include the steps of providing a wire and placing conductive powder upon the wire. One embodiment of the present invention creates multiple wires from a foil sheet and electrophoretically deposits conductive powder element upon the wire.

REFERENCES:
patent: 3440495 (1969-04-01), Howard et al.
patent: 4090231 (1978-05-01), Millard et al.
patent: 4984130 (1991-01-01), Düll et al.
patent: 5986877 (1999-11-01), Pathare et al.
patent: 6238444 (2001-05-01), Cadwallader
patent: 6380577 (2002-04-01), Cadwallader
patent: 6400556 (2002-06-01), Masuda et al.
patent: 6410083 (2002-06-01), Pozdeev-Freeman
patent: 6541302 (2003-04-01), Huber et al.

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