Surface-mount flat package semiconductor device

Details Surface-mount flat package semiconductor device Surface-mount flat package semiconductor device

1994-11-23

1996-05-28

Limanek, Robert P.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

257666, 257796, 257675, 257706, 257775, H01L 2328, H01L 2336

Patent

active

055214290

ABSTRACT:
A surface mount flat package for a semiconductor device includes a number of leads on a lead frame. At least one of the leads is straight with a thick section and a thin section. Part of the thin section is inside a protective medium and part extends outside. A bottom surface of the part extending outside the protective medium serves as a connection terminal for the semiconductor device. Another lead is an island lead that has a bonding island on an upper surface thereof. The island lead has a thick section and a thin section. The bonding island is on the thin section. The thin section is entirely within the protective medium. A bottom surface of the thick section is exposed outside the protective medium to serve as a connection terminal. The bottom surfaces of the thick sections are coplanar with each other and preferably coplanar with a bottom surface of the package.

REFERENCES:
patent: 4460917 (1984-07-01), Rogers
patent: 4750030 (1988-06-01), Hatakeyama

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