Surface mount electronic component having electrodes...

Details Surface mount electronic component having electrodes... Surface mount electronic component having electrodes...

1999-11-22

2001-11-13

Riley, Shawn (Department: 2838)

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

C257S693000, C257S696000

Reexamination Certificate

active

06316726

ABSTRACT:

FIELD OF THE INVENTION
The present invention relates to the field of surface mount electronic components employed in general electronic equipment and power supply devices.
BACKGROUND OF THE INVENTION
FIG. 8
is a sectional view of a conventional surface mount capacitor.
As described in
FIG. 8
, an electrode material
2
is formed on both main faces of a dielectric substrate
1
. A lead terminal
3
connected to each electrode material
2
extends to an external terminal
3
a.
The entire assembly is then covered with an external packaging material
4
, except for the external terminal
3
a
which protrudes from the external packaging material
4
and is formed on the external packaging material
4
.
As most electronic equipment becomes smaller, surface mount electronic components used in such equipment also need to further reduce the size in proportion. However, examination of the feasibility of creating smaller surface mount capacitors with the configuration shown in
FIG. 8
reveals that problems may occur due to migration and reduced resistance to electrical breakdown.
SUMMARY OF THE INVENTION
A surface mount electronic component of the present invention includes the following: a substrate; more than one electrode, made of a material unlikely to cause migration, which substantially covers entire surfaces of both of the main faces of the substrate; more than one lead terminal bonded respectively to the electrodes using a bonding material; and an external packaging material entirely covering the faces of the substrate and electrodes, and at least part of the lead terminals.
The above configuration prevents the occurrence of migration even if the substrate becomes thinner as a result of the miniaturization and slimming of surface mount electronic components. Thus, characteristics such as capacitance are unlikely to change during use. The formation of the electrodes over most of the main faces of the substrate prevents concentration of electric line of force on the substrate ends, enabling the electric line of force to be uniformly distributed. Thus, resistance to electrical breakdown may be improved.
Furthermore, in the surface mount electronic component of the present invention, a first electrode made of a material unlikely to cause migration is formed on the substrate and a second electrode made of a material likely to adhere the bonding material is formed on the first electrode.
This configuration enables the bonding strength between the second electrode and lead terminal to be increased even in the case of poor adhesivity between the material for the first electrode and the bonding material. This prevents degradation of characteristics, for example, due to peeling of the lead terminal from the electrode during the manufacturing processes.


REFERENCES:
patent: 4497012 (1985-01-01), Gottlieb et al.
patent: 4510554 (1985-04-01), Irikura
patent: 4933811 (1990-06-01), Dorlanne
patent: 4959505 (1990-09-01), Ott
patent: 5420745 (1995-05-01), Hidaka et al.
patent: 6046507 (2000-04-01), Hatchard et al.
patent: 62-192630 (1986-05-01), None

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