Surface mount device with high thermal conductivity

Details Surface mount device with high thermal conductivity Surface mount device with high thermal conductivity

1992-04-21

1993-02-23

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437209, 437215, 257207, 257711, 257693, H01L 2160

Patent

active

051889854

ABSTRACT:
A surface mount package for encapsulating an electronic device is provided. The package has a ceramic frame containing a plurality of apertures. Copper-tungsten composite metallic components are bonded to the ceramic frame and individually extend across each of the apertures. The metallic components may include a flange for bonding and a pedestal extending into each aperture.

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Shinko Electric, Power Transistor Ceramic Package, LCC-3 Series Ceramic Packages having Tungsten-Copper Plates on Both Sides of Base, Metallized Tungsten Thermal Vias Interconnect the Plates.

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