Surface mount device with high thermal conductivity

Details Surface mount device with high thermal conductivity Surface mount device with high thermal conductivity

1991-03-29

1992-05-05

Epps, Georgia Y.

357 72, 357 80, H01L 2302

Patent

active

051112779

ABSTRACT:
A surface mount package for encapsulating an electronic device is provided. The package has a ceramic frame containing a plurality of apertures. Copper-tungsten composite metallic components are bonded to the ceramic frame and individually extend across each of the apertures. The metallic components may include a flange for bonding and a pedestal extending into each aperture.

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Metals Handbook.RTM. Ninth Edition, vol. 7, Powder Metallurgy, American Society for Metals, Metals Park, Ohio 44073, Jun. 1984, pp. 551-566.

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