Surface-mount device package having an integral passive componen

Details Surface-mount device package having an integral passive componen Surface-mount device package having an integral passive componen

1998-06-05

2000-08-22

Gaffin, Jeffrey

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361765, 361766, 361767, 361772, 361782, 361783, 257780, 257533, 257536, 257537, 174255, 338330, 338331, 338333, H01L 23522, H01L 23532

Patent

active

061082120

ABSTRACT:
The surface-mount device package comprises a pad located on a face of the surface-mount device, a solder bump bonded to the pad, and a terminal spaced radially apart from the pad. A terminal surrounds the pad in at least one common plane that bisects the pad and the terminal. An electrically resistive volume intervenes between the pad and the terminal. The pad is electrically coupled to the terminal through the resistive volume. The terminal, the pad, and the electrically resistive volume cooperate to form a passive component associated with at least one device interconnection. The passive component preferable comprises an integral resistor. The integral resistor serves to eliminate or at least substantially reduce electrical resonances and reflections that may otherwise degrade the signal integrity.

REFERENCES:
patent: 4777718 (1988-10-01), Henderson et al.
patent: 4782381 (1988-11-01), Ruby et al.
patent: 5347258 (1994-09-01), Howard et al.
patent: 5603847 (1997-02-01), Howard et al.
patent: 5912507 (1999-06-01), Dunn et al.

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