Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Responsive to electromagnetic radiation
Reexamination Certificate
2002-06-18
2004-11-09
Thai, Luan (Department: 2827)
Semiconductor device manufacturing: process
Making device or circuit responsive to nonelectrical signal
Responsive to electromagnetic radiation
C438S113000
Reexamination Certificate
active
06815249
ABSTRACT:
BACKGROUND OF THE INVENTION
The present invention relates to a surface-mount device and to a method for manufacturing the surface-mount device.
FIGS. 7 and 8
show a conventional light-emitting device as a surface-mount device (SMD). The light-emitting device
110
comprises an LED
101
mounted on a substrate
102
as an electronic element, electrodes
103
and
104
, each formed on the upper surface, side wall, and underside of the substrate
102
. The cathode
101
c
of the LED
101
is directly connected to the electrode
103
, and the anode
101
a
is connected to the electrode
104
by a bonding wire
106
. The LED
101
, bonding wire
106
and electrodes
103
and
104
are covered by a protector layer
107
. The light-emitting device
110
is manufactured together with a number of other light-emitting devices on a substrate aggregation and cutoff from the adjacent substrate
102
a
at an elongated through-hole
105
.
On the other hand, the protector layer
107
is formed by injecting a liquid resin in a mold mounted on the substrate
102
. In order to prevent the liquid resin from entering the through-hole
105
, the protector layer
107
must be formed at a position away from the through-hole
105
. As a result, the size of the substrate becomes large.
A light-emitting device
120
shown in
FIGS. 9 and 10
dissolves the above described problem.
The light-emitting device
120
comprises an LED
121
mounted on a substrate
122
, electrodes
123
and
124
. The substrate
122
has a pair of grooves
122
a
and
122
b
, each having a semicircular section, at opposite sides thereof. The upper side and underside portions of the electrode
123
(
124
) are connected to each other by a connector portion
123
a
(
124
a
) formed in the groove
122
a
(
122
b
).
Each of the grooves
122
a
and
122
b
is closed by a dry film
125
at the upper opening. The whole upper surface is sealed by a protector layer
127
. The dry film
125
prevents the material of the protector layer
127
from entering the groove
122
a
(
122
b
).
In the light-emitting device, the electrode is not projected from the protector layer
127
. Therefore, the size of the device is reduced. However if the dry film
125
does not exist, the device can be more miniaturized.
A light-emitting device
130
of
FIGS. 11 and 12
is to achieve such an aim.
The light-emitting device
130
comprises an LED
131
mounted on a substrate
132
, and a pair of electrodes
133
and
134
. Each of the electrodes comprises an upper electrode
133
a
(
134
a
) of copper foil, a lower electrode
133
b
(
134
b
) of copper foil, and a connecting layer
133
c
(
134
c
) formed in a groove
132
a
(
132
b
). A protector layer
137
seals the LED
131
and others.
A method of forming the electrode
133
will be described hereinafter with reference to
FIGS. 13
a
to
13
d.
Referring to
FIG. 13
a
, the upper electrode
133
a
and lower electrode
133
b
are formed on upper and lower sides of the substrate
132
with copper foil. A part of the lower electrode
133
b
is removed at a position corresponding to the groove
132
a
by etching as shown in
FIG. 13
b
. A part of the substrate
132
is removed to form the groove
132
a
by laser processing as shown in
FIG. 13
c
. Next, the connecting layer
133
c
is formed on the surfaces of the groove
133
a
, the underside of the upper electrode
133
a
and the underside of the lower electrode
133
b
as shown in
FIG. 13
d.
The light-emitting device
130
can be made into a small size compared with the light-emitting device
120
of
FIG. 9
, since the dry film is not provided. However, since the groove
132
a
of the device
130
is formed by the laser processing, the manufacturing cost increases.
SUMMARY OF THE INVENTION
An object of the present invention is to provide a light-emitting device which may be made into a small size at a low cost.
According to the present invention, there is provided a surface-mount device comprising a substrate, having a pair of grooves, each communicating an upper surface and a lower surface with each other, a pair of electrodes, each of which comprises an upper electrode and a lower electrode, a connecting layer formed on an inside wall of each of the grooves to electrically connect the upper electrode and the lower electrode with each other, an electronic element mounted on one of the electrodes, a lid provided in an upper portion of each of the grooves, a protector layer formed on the substrate to seal the upper electrode, electronic element and lids.
The lid is made of resist material, and the electronic element is an LED.
The grooves are formed in opposite sides of the substrate.
The present invention further provides a method for manufacturing a surface-mount device, comprising the steps of preparing a substrate aggregation having a plurality of substrate divisions, and through-holes between adjacent substrate divisions, forming a pair of electrodes, each comprising an upper electrode and a lower electrode on an upper surface and a lower surface of the substrate division, forming a connecting layer on an inside wall of through-hole for electrically connecting the upper and lower electrodes, mounting an electronic element on one of the upper electrodes, closing an upper opening of the through-hole by a lid, sealing the electronic element, the upper electrodes and lids with a protector layer, and cutting off each of the substrate divisions from the substrate aggregation at through-holes.
The lid is formed by charging a resist material in the through-hole, solidifying an upper portion of the charged resist material, and removing a non-solidified portion from the through-hole.
These and other objects and features of the present invention will become more apparent from the following detailed description with reference to the accompanying drawings.
REFERENCES:
patent: 6383835 (2002-05-01), Hata et al.
Citizen Electronics Co. Ltd.
Dennison, Schultz, Daugherty & MacDonald
Thai Luan
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