Surface mount device

Details Surface mount device Surface mount device

1993-05-20

1994-08-16

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

257706, 361719, 361767, H05K 720

Patent

active

053392183

ABSTRACT:
A circuit board assembly comprising a surface-mounted microelectronic device combination, including a metallic base member having an insulating layer thereon, and a plurality of electrically conductive mounting pads patterned on the insulating layer. At least one pair of hermetically sealed diodes is bonded to the pads, such that each diode of each pair has one terminal bonded to a first pad, and the other terminal bonded to second and third pads, respectively. For example, a two-diode combination is provided with three leads, one for each pad, whereby various lead connections may be selected, for the purpose of using each diode separately; or for the purpose of using both diodes, either in series or in parallel.

REFERENCES:
patent: 3763403 (1973-10-01), Lootens
patent: 4067041 (1978-01-01), Hutson
patent: 4069497 (1978-01-01), Steidlitz
patent: 4117508 (1978-09-01), Koenig
patent: 4509096 (1985-04-01), Baldwin
patent: 4583283 (1985-04-01), Dubois et al.
patent: 4788584 (1988-11-01), Hirano et al.
patent: 5079618 (1992-01-01), Farnworth
patent: 5130888 (1992-07-01), Moore

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