Surface mount composite electronic component and method for...

Details Surface mount composite electronic component and method for... Surface mount composite electronic component and method for...

2004-11-12

2009-10-13

Reichard, Dean A. (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C361S752000, C361S760000

Reexamination Certificate

active

07601920

ABSTRACT:
The present invention provides a surface mount composite electronic component which can be made compact. The structure of the surface mount composite electronic component is one in which a circuit element is formed on each of a set of opposing surfaces of an insulating substrate composed of a hexahedron, with electrodes that make up the circuit elements also functioning as external terminals. For example, a pair of first electrodes disposed on both ends of a front surface of the insulating substrate composed of a hexahedron, a pair of second electrodes disposed on a rear surface of the insulating substrate opposite the first electrodes, a first resistor disposed so as to contact both of the first pair of electrodes, and a second resistor disposed so as to contact both of the second electrodes.

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