Surface mount components and semifinished products thereof

Details Surface mount components and semifinished products thereof Surface mount components and semifinished products thereof

1995-04-10

1996-10-22

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361776, 361803, 361813, 257676, 174254, H01R 900

Patent

active

055683630

ABSTRACT:
A surface mount component comprising an IC chip, and a plurality of leads extending outward from the body of the chip. The leads are interconnected by an insulating frame at their outer ends. Each of the leads is provided in the vicinity of the portion thereof joined to the frame with an outer lead portion to be electrically connected to a wiring board. The frame is integrally connected to the chip body by bridges. When the component is mounted on the surface of the wiring board, the outer lead portion of each lead is bonded to the board by a solder layer without separating off the frame.

REFERENCES:
patent: 4249299 (1981-01-01), Stephens
patent: 4835847 (1989-06-01), Kamperman
patent: 5045914 (1991-09-01), Casto
IBM Technical Disclosure Bulletin, Flat Package Using Three-Layer Film, Jan., 1989, p. 119 of vol. No. 8.
Japan Abstract vol. 11, #306 (E-546) (2753), Oct. 6, 1987.
Japan Abstract vol. 12, #135 (E-604), Apr. 23, 1988.
IBM Tech., Disclosure Bulletin; vol. 31, #8, Jan. 1989; N.Y. US p. 119.
Patent Abstract of Japan, vol. 13, #550 (P-972) Dec. 8, 1989 & JP-A-12 29 228 (Hitachi Ltd).
Patent Abstract of Japan, vol. 11, #4 (E-468) (2451) Jan. 7, 1987 & JP-A-61 179 560 (Rishiyou Kogyo K.K.).

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