Surface mount component for selectively configuring a printed ci

Details Surface mount component for selectively configuring a printed ci Surface mount component for selectively configuring a printed ci

1995-12-06

1997-12-23

Sparks, Donald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361820, 257695, 257786, H01R 909

Patent

active

057012342

ABSTRACT:
A surface mount component which can be mounted to a surface of a printed circuit board having a plurality of bonding pads connected to circuitry provided on the printed circuit board, which includes a puck having first and second wiring patterns, and a plurality of electrical connectors, a first set of electrical connectors being connected to the first wiring pattern, and a second set of the electrical connectors connected to the second wiring pattern. During the process of manufacturing a product which incorporates the printed circuit board, a production line worker can mount the puck to the surface of the printed circuit board in a selected one of a plurality of different possible positions, with at least selected ones of the first and second sets of electrical connectors being connected to respective ones of said bonding pads, to thereby achieve a selected one of a plurality of different selectable circuit configurations. A method for using the puck to achieve a selected one of a plurality of different selectable circuit configurations is also disclosed.

REFERENCES:
patent: 4003073 (1977-01-01), Helda et al.

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