Surface mount component

Details Surface mount component Surface mount component

2001-04-16

2003-04-22

Talbott, David L. (Department: 2827)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S255000, C174S265000, C361S756000, C361S760000, C361S772000, C257S696000, C257S730000, C257S779000

Reexamination Certificate

active

06552275

ABSTRACT:

TECHNICAL FIELD
The present invention relates generally to connectors, and in particular relates to surface mount connectors methods of attachment therefor.
BACKGROUND
Circuit boards are designed to have more power with increasing capabilities, and simultaneously being designed to achieve more using less space, at faster speeds, without substantially adding to the overall cost of the product. As a result, more chips, as well as other types of components, are being surface mounted to the printed circuit board, resulting in a higher component density within a smaller volume of space. However, conventional surface mount processing and methods are sometimes incapable of adequately providing a reliable high density surface mountable component, such as a connector. Furthermore, conventional surface mount processing is sometimes incapable of adequately providing a reliable surface mount component which can handle forces applied to printed circuit boards in standard processes, such as assembly, testing and/or shipping, and in the user field, post-production.
One example of the kinds of forces applied to the surface mount components is during assembly of the printed circuit board. In tough handling processes, such as shipping and/or testing, which place additional stresses on the circuit board and/or the surface mount components, the risk of mechanical and/or electrical failure of these surface mount components is increased. Furthermore, similar or other conditions in the user field could result in failure.
One example of a component which is surface mounted on to the printed circuit board is a surface mount RJ45 connector. In current RJ45 connectors, the plastic body
50
of the connector is substantially square-shaped at a juncture near the lead
52
, the printed circuit board
54
, and a lower edge
56
of the plastic body
50
, as shown in FIG.
1
. The square shape is disposed directly adjacent to the lead
52
and the printed circuit board
54
. When solder is flowed around the leads
52
of the component, the solder flow is obstructed during the reflow process, and a high concentration of stress results in the encircled area
60
of the fillet
66
. Furthermore, mounting pegs
64
are disposed through the printed circuit board
54
, and a distal end
62
of the mounting pegs
64
protrudes out of the printed circuit board
54
. As the printed circuit board is placed on planar surfaces, such as during testing, further stress is placed on the fillet
66
, occasionally causing the fillet
66
to crack. The solder joints at the leads have a marginal tensile strength, and are prone to developing mechanical fractures at this same location, leading to mechanical and/or electrical failure.
Accordingly, what is needed is a surface mount component that can be better secured to the printed circuit board. What is further needed is a method of attaching a surface mount component that is better secured to the printed circuit board.


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