Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1992-12-21
1993-07-13
Abrams, Neil
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439526, 439680, 439876, H01R 2372
Patent
active
052268250
ABSTRACT:
A chip carrier socket 2 comprises, a chip carrier receiving member, multiple electrical terminals 4 extending over component mounting pads 64 of a substrate 10, and surface mount contacts 62 of the terminals 4 being aligned so as to engage the conductive mounting pads 64 that are in alignment with conductive leads 6 of a chip carrier 8, whereby the same mounting pads 64 can be used for surface mount attachment to the leads 6, and can be used for surface mount attachment to the terminals 4 of the chip carrier socket 2. The terminals include recesses 66 on edges adjacent to the surface mount contacts to prevent these edges from being wetted by solder. Certain ones of the terminals include posts 38 to uniquely orient the socket 2 with respect to the substrate 10.
REFERENCES:
patent: Re33268 (1990-07-01), Grabbe et al.
patent: 4089575 (1978-05-01), Grabbe
patent: 4872845 (1989-10-01), Korsunsky et al.
patent: 4936784 (1990-06-01), Saito
Ricci, Jr. Ronald R.
Walker Kevin E.
Abrams Neil
Kapalka Robert J.
Kita Gerald K.
The Whitaker Corporation
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